Prioritizing reliable, high quality electronics

Effectively reduce defect rates to zero and maximize product lifetime with rigorous quality management systems, globally recognized materials and production equipment, advanced inspection and test equipment and functional test support.

How do we maintain our high quality standards?

PCB DFM Review

Design for Manufacture review for bare PCB boards check the supplied data for errors such as incomplete/unclear instructions, insufficient clearances, opens/shorts, missing features, etc.

PCB AOI

Automated Optical Inspection (AOI) for both inner and outer copper layers optically compare snapshots of the layers with the bare copper to find discrepancies, which can be corrected on the spot.

In-Circuit Testing (ICT)

100% flying probe testing or batch fixture testing (bed of nails) for every PCB catches electrical shorts and opens on the completed PCB.

Microsectioning and Impedance Testing

Microsectioning and impedance test coupons are used to verify through-hole plating thickness and controlled impedance respectively, which are crucial in high-speed multilayer designs.

PCBA DFA Review

Design for Assembly review is performed by an engineer by verifying production data at the earliest stage possible. DFA review covers footprint checks, BOM inconsistencies, panel design and evaluates non-standard requests.

Incoming Parts Inspection (IQC)

Incoming parts inspection is the process where samples of all delivered components are examined and counted to ensure the parts are genuine, match specifications and are in a new, unused state.

Solder Paste Inspection (SPI)

Most reflow solder defects result from poor solder paste application. Solder Paste Inspection uses 2D or 3D optical methods to gauge the quality of the applied solder paste.

PCBA AOI

Automated Optical Inspection for populated PCBs compares photos of solder joints and compare them with training samples to highlight defects.

X-ray Inspection

X-ray inspection uses x-rays to look at hidden joints on the undersides of components such as on BGA chips and connectors which are otherwise impossible to inspect.

First Article Inspection (FAI)

First Article Inspection is used to verify a sample before proceeding with the batch run to confirm parts and placement. Special FAI machines are used to help with the process of verification.

Functional Testing

Ensure every device works off the production line and into customers’ hands with 100% functional testing and effectively reduce the defect rate to zero. Or sample test to verify the entire turnkey process and identify catastrophic issues early on.

Visual Inspections

Manual visual inspections at every stage of production help single out defects not detectable by automated means.

Testing and Engineer Services

Design for Excellence

Design for Manufacture and Assembly
Design for Mass Production
Design for Test
Design for Cost

Programming

Firmware Flashing
IC Programming

Environmental Testing

Temperature
Humidity
Pressure
Shock

Certification Assistance

CE/FCC
UL
RoHS/REACH
EMC Compliance

Functional Testing

100% functional test
Sample functional test
Fixture support

Our Customers

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